SMT Assembly Processing

SMT Assembly Processing

• Daily Production Capacity: 5 million soldering points
• SMT Processing Dimensions: Maximum size 490 x 810 mm
• Board Thickness Range: 0.3–6.5 mm
• Order Quantity: 1–100,000 pcs
• Electronic Components:
  1. Passive components, minimum package size 01005
  2. Fine pitch spacing as small as 0.25 mm
• Soldering Types:
  • Through-hole components (DIP devices)
  • Surface-mount components (SMT devices)
  • Mixed assembly of SMT and through-hole components
  • Double-sided assembly (including SMT and through-hole components)
• Application Fields:
  High-end electronic assembly industries, including medical devices, industrial control equipment, aerospace, and military electronics.